UHVCVD Systems

Ultra-High Vacuum Multi-Chamber Cluster Tool (UHVCVD) Systems

Ultra-High-Vacuum-CVD

CVD Equipment Corporation’s Ultra-High Vacuum Chemical Vapor Deposition (UHVCVD) System is an automatically controlled research unit designed for processing of up to one – 200 mm diameter wafer at temperatures up to 900 °C. The system consists of a loadlock chamber and deposition tube. The loadlock chamber contains the robot that moves the 200 mm wafer between the loadlock and the process tube. The high vacuum loadlock minimizes the transfer of ambient atmosphere into the process tube.

Process Tube Vacuum System - is designed for operation of the process tube at less than 10 mTorr and is capable of pumping a clean process tube to a level of less than 10-9 Torr at room temperature with no gas flows.

Loadlock Vacuum System - is designed for pumping a clean loadlock to a level of less than 107 Torr at room temperature with no gas flows.

Heating System - CVD Equipment Corporation’s resistance heating element is specifically designed for applications requiring precision uniform heating in both the radial and axial directions. The low mass three zone heating element is designed to give 900 °C maximum heating, a uniform flat zone (±0.5 °C) extremely quick response and long life.

The gas system is designed to be in close proximity to the process chamber gas inlet to allow for close coupling between components and the process chamber. This provides for minimal line length, dead space, and allows for fast gas switching

We also offer multi-chamber cluster systems with on LPCVD chamber and/or an evaporator chamber attached to the UHVCVD chamber. A high vacuum transfer chamber is provided to allow wafer transfer between process chambers under partial pressure of H2.

A typical use of this system is for low temperature deposition of silicon, silicon germanium and germanium epitaxial films where abrupt changes in composition and dopant levels are required.

UHVCVD SYSTEM FEATURES & OPTIONS

  • CVDWinPrC™ system control software for real time process control, data logging, and recipe editing
  • Process tube vacuum system is designed for operation of the process tube at less than 10 mTorr and is capable of pumping a clean process tube to a level of less than 10-9 Torr at room temperature with no gas flows
  • Loadlock vacuum system is designed for pumping a clean loadlock to a level of less than 107 Torr at room temperature with no gas flows
  • Resistance heating element is specifically designed for applications requiring precision uniform heating in both the radial and axial directions
  • Low mass three zone heating element is designed to give 900 °C maximum heating

powered by CVDWinPrC

Operated through our CVDWinPrC™ process control software, the systems automatically log data and graphically show time-dependent values of user-selected parameters. CVDWinPrC™ also allows users to load preprogrammed recipes, modify, check and create new recipes, and view realtime or saved process data.

Safety Protocols

The systems have application configured safety protocols embedded into relay logic, PLC, and CVDWinPrC™ software.

The images shown are examples of many CVD systems we design and manufacture in-house for innovators working on next generation process and material development.
We have customers worldwide at universities, governmental labs, start-ups, and fortune 500 companies.